台灣電機電子工程學會
Taiwan Institute of Electrical and Electronic Engineering
各位老師好,
北瀚科技 將於 5/13、5/14、5/20日下午1:30~3:30 分別在台南成大、高雄中山、台中東海舉辦技術研討會, 歡迎有興趣的老師及研究生踴躍報名參加!
附檔為相關議程邀請函。
Best Regards,
Pauline
軟體及硬體工程師間的快速溝通橋樑 !
軟體運算區塊/系統(C++ or Simulink)的加速與硬體化 !
積體電路設計前期的快速模擬與驗證 !
北瀚科技( SMIMS Corp.)是國內唯一自行開發PC-Based FPGA發展平台的公司。SMIMS Development Platform以Xilinx /Altera FPGA為基礎,利用USB2.0介面與PC相連，讓使用者能簡單地把高階語言(C/C++或Simulink/Matlab)運算模組與FPGA電路相結合,達到軟硬體共同開發設計的目的。讓「PC的相關週邊都成為使用者所設計電路的I/Os ! 所有軟體區塊都可以與使用者所設計電路共同運作 !」
歸納本公司之平台有以下特點:
l. Easy Use
平台使用USB介面與 PC溝通及下載電路，是PC-Based的FPGA 發展平台(Altera/Xilinx)。
2. Software/Hardware Co-design
提供C/C++及Simulink/Matlab等介面，使用者可輕易地將自己設計的軟體運算區塊與FPGA上的HDL-based電路共同模擬、測試驗證。
3. Powerful monitor tools
提供監控軟體Vericomm, 讓使用者不用接 LA即可在PC端檢視電路I/O接腳訊號變化。
4. Expandable I/O Module
提供虛擬元件軟體, 讓使用者無限擴充 I/O module。
5. Support Immediately
軟硬體皆台灣自行開發,技術支援迅速確實,並設有討論區與使用者技術交流。
目前北瀚科技之FPGA發展平台已被台、清、交、成等國立大學教授應用於研究發展，也被部分學校採納為上課用模擬平台。
******************************************************
林俞秀 Pauline Lin
北瀚科技股份有限公司 SMIMS Technology Corp.
Tel:886-06-2381238
Fax:886-06-2742569
Mobile:0987366254
SKYPE:pauline729
台南市701大學路1號成大育成中心411室
We create Smart, Multiple, Integrated, Media System
**********************************************
 2009北瀚 PC-based FPGA驗證平台研討會-中南部 | [ ] | 73 Kb |
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| VeriCommProDS.pdf | [ ] | 123 Kb |
| VeriEnterpriseVEXDS.pdf | [ ] | 152 Kb |
| VeriLinkDS.pdf | [ ] | 119 Kb |
============== CENICS 2009 | Call for Papers ===============
CALL FOR PAPERS, TUTORIALS, PANELS
CENICS 2009: The Second International Conference on Advances in Circuits, Electronics, and Micro-electronics
October 11-16, 2009 - Sliema, Malta
General page: http://www.iaria.org/conferences2009/CENICS09.html
Call for Papers: http://www.iaria.org/conferences2009/CfPCENICS09.html
Submission deadline: May 20, 2009
Technically Co-sponsored by the IEEE Malta Section
Sponsored by IARIA, www.iaria.org
Submissions will be peer-reviewed, published by IEEE CPS, posted in IEEE Digital Library, and indexed with the major indexes
Extended versions of selected papers will be published in IARIA Journals:
http://www.iariajournals.org
Please note the Poster Forum and Work in Progress track
The topics suggested by the conference can be discussed in term of concepts, state of the art, research, standards, implementations, running experiments, applications, and industrial case studies. Authors are invited to submit complete unpublished papers, which are not under review in any other conference or journal in the following, but not limited to, topic areas.
All tracks are open to both research and industry contributions, in erms of Regular papers, Posters, Work in progress, Technical/marketing/business presentations, Demos, Tutorials, and Panels.
Before submission, please check and conform with the Editorial rules:
http://www.iaria.org/editorialrules.html
CENICS 2009 Tracks (tracks' topics and submission details: see CfP on the
site)
- Semiconductors and applications
- Design, models, and languages
- Signal processing circuits
- Arithmetic computational circuits
- Microelectronics
- Electronics technologies
- Special circuits
- Consumer electronics
- Application-oriented electronics
==========================
CENICS Advisory Chairs
Kenneth Blair Kent, University of New Brunswick, Canada
Petre Dini, Cisco Systems, Inc., USA / Concordia University, Canada
Olivier Franza, Intel Corporation, USA
Tomas Palacios, Massachusetts Institute of Technology, USA
C跣did Reig, University of Valencia, Spain
CENICS 2009 Industry-Research Chairs
William C. Hasenplaugh, Intel Corporation, USA
F幨ix Tor嫕, European Space Agency/Centre Spatial de Toulouse, France
Yousaf Zafar, Gwangju Institute of Science and Technology (GIST), Republic of Korea
CENICS 2009 Technical Program Committee Chairs
Josu Etxaniz Mara嚧n, Euskal Herriko Unibertsitatea/Universidad del Pa疄
Vasco, Spain
Ali Rostami, University of Tabriz, Iran
David Zammit-Mangion, University of Malta-Msida, Malta
Committee members: http://www.iaria.org/conferences2009/ComCENICS09.html
==========================
敬啟者您好：
煩請 轉告貴系同學周知本系2009電子工程技術研討會資訊，謝謝！
論文全文投稿日期：即日起~2009年4月20日將延至於2009年4月27日(星期一)止
通知論文接受函日期：2009年5月8日(星期五)
詳細可參閱研討會網址：http://www.ene.isu.edu.tw/ets2009
歡迎大家踴躍投稿，謝謝!!
 ETS2009.jpg | [ ] | 621 Kb |
============================================================================
IFIP/IEEE VLSI-SoC 2009
17th International Conference on Very Large Scale Integration
October 12-14, 2009,
Florianópolis, Brazil
http://www.inf.ufrgs.br/vlsisoc/
----------------------------------------------------------------------------
FINAL CALL FOR PAPERS
----------------------------------------------------------------------------
IMPORTANT DATES:
Paper Submission: April 15, 2009
Special Session Proposal: April 15, 2009
Notification of acceptance: June 16, 2009
Camera-ready: July 11, 2009
============================================================================
ABOUT VLSI-SoC 2009
VLSI-SoC 2009 is the 17th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state-of-the-art and the new developments in the field of Very Large Scale Integration Systems and their designs. Previous Conferences have taken place in Edinburgh, Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta and Rhodes. The purpose of the Conference is to provide a forum to exchange ideas and to show industrial and research results in the fields of VLSI/ULSI Systems, VLSI CAD and Microelectronic Design and Test.
Topics of interest include but are not limited to:
* Analog, Digital, and Mixed-Signal IC Design
* 3-D Integration and Physical Design
* Deep Submicron Design and Modeling Issues
* New Devices and MEMS
* Testability and Design for Test
* CAD and Tools
* Digital Signal Processing and Image Processing IC Design
* Prototyping, Validation, and Verification
* Modeling and Simulation
* System-On-Chip Design
* Embedded Systems Design
* New Architectures and Compilers
* Reconfigurable Systems
* Low-Power Design
* Logic and High-Level Synthesis
* New Applications (communications, biosystems, video, automobile, security, sensor networks, etc.)
* Real-Time Systems
----------------------------------------------------------------------------
SUBMISSION INSTRUCTIONS:
Papers should present original research results not published or submitted for publication in other forums. Papers should not exceed 6 pages (single-spaced, 2 columns, 10pt font; see the VLSI-SoC website for detailed
guidelines) and must be submitted electronically using the VLSI-SoC 2009 website. The proceedings will be published by IEEE and available through IEEE Xplore. They will be distributed during the conference to all participants. A selection of the conference best papers will be invited to submit an extended version to be included as chapters of a book to be published by Springer.
----------------------------------------------------------------------------
GENERAL CHAIR:
* Ricardo Reis, UFRGS, Brazil
PROGRAM CHAIR:
* Juergen Becker, KIT, Germany
LOCAL CHAIR:
* José Luís Güntzel, UFSC, Brazil
PUBLICITY CHAIR:
* David Atienza, EPFL, Switzerland, and UCM, Spain
STEERING COMMITTEE:
* Manfred Glesner, TU Darmstadt, Germany
* Salvador Mir, TIMA, France
* Ricardo Reis, UFRGS, Brazil
* Michel Robert, LIRMM, France
* Luis Miguel Silveira, INESC ID, Portugal
----------------------------------------------------------------------------
SPONSORS:
VLSI-SoC 2009 is kindly supported and sponsored by the following companies and institutions:
+ IFIP WG 10.5
+ IEEE Council on Electronic Design Automation (CEDA)
+ ACM SIGDA
+ Springer
The 3rd IEEE International Conference on e-Learning in Industrial Electronics is seeking publications on various topics of interest in the international community. Technical program chair is local gold member Dr.
Milos Manic.
http://www.uninova.pt/icelie2009/
| ICELIE2009.pdf | [ ] | 56 Kb |
===============================================
Call for Papers
IEEE ATS 2009
18th Asian Test Symposium
November 23-26, 2009. Taichung, Taiwan.
===============================================
The Asian Test Symposium (ATS) provides an open forum for researchers and
engineers from all countries of the world, especially from Asia, to exchange
innovative ideas on system, board, and device testing with design,
manufacturing and field considerations in mind.
Topics of interest:
Original contributions on testing are solicited. Topics of interest include,
but are not limited to, the following categories:
* Automatic Test Generation / Fault Simulation
* Design for Testability / DfX
* Built-In Self-Test
* Test Data Compression
* Delay Testing
* Design Verification
* Low-power Testing
* Defect-Based Testing / IDDX Testing
* Fault Modeling & Diagnosis
* Memory Test / FPGA Test
* Analog and Mixed-Signal Test
* RF Testing
* High-Speed I/O Test
* System-on-a-Chip Test
* System-in-Package Test
* Board and System Test
* On-line Testing
* Network Protocol Testing / NoC Testing
* Software Testing
* Economics of Test
* Others
Important dates:
Submission deadline: May 11, 2009
Notification of acceptance: July 10, 2009
Camera-ready copy: August 10, 2009
Symposium: November 23-26, 2009
Submission Guidelines:
The ATS'09 Program Committee invites original, unpublished paper submissions
on the above topics. Paper submissions should be complete manuscripts, not
exceeding six pages (including figures, tables, and bibliography) in a
standard IEEE two-column format. Authors should clearly explain the
significance of the work, highlight novel features, and describe its current
status. On the title page, please include: author name(s) and
affiliation(s), and the mailing address, phone number, fax number, and
e-mail address of the contact author. A 50-words abstract and five keywords
are also required. All submissions are to be made electronically through the
ATS’09 website. Electronic submissions in PDF files are strongly
recommended. Detailed instructions for submissions are to be found at the
ATS’09 website.
The submission will be considered evidence that upon acceptance the
author(s) will prepare the final manuscript (6 pages for regular session) in
time for inclusion in the proceedings and will present the paper at the
Symposium.
Sponsors:
IEEE Computer Society
Test Technology Technical Council (TTTC)
In Cooperation with:
National Chung Hsing University, Taiwan
National Science Council, Taiwan
Ministry of Education, Taiwan
Industrial Tech. Research Inst., Taiwan
Additional Information:
Please visit the symposium homepage ( http://ats09.nchu.edu.tw/) for detailed
information and updates.
| ATS09-CFP.pdf | [ ] | 154 Kb |