台灣電機電子工程學會
Taiwan Institute of Electrical and Electronic Engineering
Upon review of your expertise in composite and nanotechnology of materials or chemistry/physics of materials/devices, and metals and concrete research, it gives me pleasure to invite you to orally present a paper at the coming 17th Annual International Conference on Composites or Nano Engineering, ICCE-17, July 26-31, 2009 in Hawaii, USA.. This is a truly “international” conference to be held in the USA, where the majority of the participants are from outside USA. The topics are broad to include almost all science and engineering, due to the emphasis of interdisciplinary research in nanotechnology.
The ICCE-17 Hawaii Call for Papers has received overwhelming responses of over 600 abstracts. The emphasis of the conference is to
(1) to learn the state of the art in hot topics where funding exists, such as Biomedical or Nano research on multifunctional materials and structures,
(2) provide a forum of exchange of ideas between Chemists, Physicists, Biologists, Engineers, mathematicians and mechanicians, to promote interdisciplinary approach to Nano/Biomedical/ Composites Technology,
(3) encourage participants to conduct interdisciplinary joint research and write joint research proposals
The venue hotel rate is being negotiated (prices falling due to recession), and the venue hotel and the island will be announced soon. The conference web is,
http://www.uno.edu/~engr/composite" rel="nofollow" style="color: rgb(85, 26, 139);">www.uno.edu/~engr/composite
These ICCE-17 detailed abstracts will be reviewed and appear as short papers in World Journal of Engineering, upon payment of registration fee and attendance of ICCE-17. Further, “all” full length version of these short papers, with paper title change, will be reviewed and published in WJOE or in Composites B journal. Thus, all participants will have two journal papers as a benefit of coming to ICCE-17 Hawaii. Due to budgetary constraints, we are unable to offer financial assistance.
Looking forward to seeing you in Hawaii.
David Hui, Ph.D.,
Chairman ICCE-17 Hawaii, USA
Professor of Mechanical Engineering Univ of New Orleans
2nd CALL FOR CONTRIBUTIONS
DASIP 2009
Conference on Design and Architectures
for Signal and Image Processing
Sophia Antipolis, France
September 22-24, 2009
www.ecsi.org/dasip
DASIP 2009 will be co-located with:
- FDL 2009 conference: www.ecsi.org/fdl
- SAME 2009 conference www.same-conference.org
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IMPORTANT DATES
Deadline for special session proposals: March 10, 2009
Deadline for paper submission: March 31, 2009
Notification of paper acceptance: May 15, 2009
Author registration and final
camera-ready papers due: July 10, 2009
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SCOPE OF CONFERENCE
The development of complex applications involving signal, communication, image and control processing, is classically divided into three consecutive steps: a theoretical study of the algorithms, a study of the target architecture, and finally the implementation.
Such a linear design flow is reaching its limits due to the ever increasing intrinsic complexity of each step, to intense pressure on the design cycle and to strict performance constraints. Moreover, new challenges to designer and developers rise with the new emerging CMOS technologies introducing massive multicore processor platforms and new heterogeneous designs.
The approach, called Algorithm-Architecture-Matching, aims to leverage the design flow by a simultaneous study of both algorithmic and architectural issues, taking into account, at all steps of the application developments, multiple design constraints, as well as algorithm and architecture optimizations.
Introducing new design methodologies is necessary when facing the new emerging technologies and applications such as, for example, advanced mobile communication systems or smart sensors based systems. This forms a driving force for the future evolutions of embedded system designs methodologies.
The research community in Europe addressing these issues is very active both in academy and industry. The goals of this Conference are to present the latest results in the domain of design and architecture for signal, communication and image processing and to initiate a regular meeting that intends to be a reference for European researchers addressing this topic.
The DASIP Conference will give the opportunity for researchers to exchange the ideas and to build the collaboration on emerging topics and technologies. It also aims to strength the links between the European Information Society Technologies (IST) priorities and the researchers in the domain of design and architecture for signal and image processing.
In the context of the architectures and tools for signal and image processing DASIP 2009 topics include but are not limited to:
Methods and tools for Algorithm-Architecture-Matching
- System level design and hardware/software codesign
- RTOS for embedded systems
- Formal models and transformations
- Algorithm transformations and metrics
- Communication synthesis
- Architectural and logic synthesis
- Design verification, fault tolerance
- Performance analysis and estimations
- Rapid system prototyping, embedded software
- Embedded system security
New and emerging architectures and technologies
- SoC and MPSoC
- Reconfigurable ASIP
- FPGA, dynamic reconfigurable systems
- Asynchronous circuits (self-timed)
- Analog circuits and mixed-signal circuits
- Biologically based or biologically inspired systems
Applications
- Embedded systems for automotive
- Embedded systems for health
- Embedded platforms for multimedia and telecom
- Ambient intelligence, ubiquitous computing
- Wearable computing
- Handheld devices (smart cameras, PDAs, GPSs)
- Security systems, cryptography
- Object recognition and tracking
Smart sensors
- Vision and audio sensor
- Fingerprint sensor, biosensor
- Structurally-embedded sensor
- Sensing requirements for active control systems
- Distributed and multiplexed sensors, sensors network
- Adaptive sensor, evolutionary sensor
- Sensor for health monitoring
- Sensor system monitoring
- Environmental monitoring
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Special Sessions and Demonstrations
A number of special sessions are planned during the Conference.
Example special sessions include the following:
- Design methodologies
- New architectures for signal and image processing
- Smart sensors
- Case studies dealing with signal and image processing implementations
Demonstrations are also welcome and we encourage Authors to present their work. A special time slot will be allocated during the Conference in order to allow participants to attend demonstrations.
Prospective organisers of special sessions should submit proposals
indicating:
- Title of the session
- Rationale of the need for the special session at DASIP 2009
- Short biography of the organizers
- List of contributed papers (including titles, authors, contact
information of the corresponding authors, and a short abstract of
each contribution). Organisers should not contribute more than one
paper.
- Preliminary full version of the overview paper is desirable.
If submitted, it enhances the chances of the proposal acceptance.
Proposals are due on or before March 10th, 2009 and should be sent via email (in either pdf or plain ascii text form). Proposals will be evaluated based on the timeliness of the topic, the qualifications of the organisers and the authors of the papers proposed in the session and the balance of the topics across the technical areas in DASIP 2009.
Notification of acceptance will be sent to the organisers May 15, 2009.
Authors of the papers included in successful proposals should submit a manuscript on or before July 10, 2009. Manuscripts should conform to the formatting and electronic submission guidelines of a regular DASIP paper. They will be submitted via the online submission link and undergo peer review.
======================================================================
Instruction for Authors
Electronic paper submission requires a full paper, up to 8 double- column IEEE format pages, including figures and references.
Demonstration papers should not exceed 1 double-column IEEE format page long. Document templates are available at the following address:
http://www.ecsi.org/dasip/.
A special issue in one of the EURASIP journals is planned after the Conference in order to publish the best papers of the Conference.
The main conference topics will define the editorial of a book on the state-of-the art and perspectives in the domain of Signal and Image Processing Architectures to be published by Springer Science + Business Media publisher after the event. The authors of selected papers submitted to DASIP will be invited to prepare an extended manuscript for publication in this book.
======================================================================
ORGANIZATION
General Chair
MATTAVELLI Marco, EPFL, Switzerland
Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
ECSI Office
Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
Ph: +33 4 76 63 49 34
Fax: +33 4 76 42 87 87
======================================================================
PROGRAM COMMITTEE
List of DASIP Members is presented at: www.ecsi.org/DASIP
PROCEEDINGS
from previous DASIP conferences are available on the DASIP site
CALL FOR PAPERS
Multimedia Tools and Applications (MTAP)
An International Journal
Special Issue on “Data Hiding for Multimedia Security”
Description
The digital information revolution has brought profound changes in our daily lives and the
advantages of digital information have also generated new challenges and opportunities for their
protection. Due to the tremendous advances in signal processing and transmission techniques, it is
easy to acquire, tamper and duplicate multimedia data. For the last two decades, digital data
hiding has received a great deal of attention from the scientific community to overcome the
aforementioned problems. Remarkable research efforts have been invested in recent years, trying
to export novel and applied real world engineering applications.
This special issue intents to bring together diversity of international researchers, experts and
practitioners who are currently working in the area of digital data hiding systems. It is envisaged
that this special issue will explore the advances of methods, techniques, and tools in solving the
unsolved questions in digital data hiding. Prominent researchers both from academia and industry
are invited to contribute their work for extending the existing knowledge in the field.
Topics
Research areas of relevance to this special issue would therefore include, but not only limited to:
• Digital watermarking
• Steganology (steganography and steganalysis)
• Information theoretic analysis of data hiding systems
• Data hiding in law enforcement, medicine, military, E-commerce, and M-commerce
• Fingerprinting in multimedia signals
• Data hiding for forensic applications
• Integrity verification and authentication
• Digital content protection
• Tampering and attacks on original information
• Data hiding system design and implementation
• Digital rights management
• Content identification and secure content delivery
Important Dates
Submission of Manuscripts 15 August, 2009
Decision Notification 15 November, 2009
Submission of Camera ready paper 31 December, 2009
Submission Details
Paper Format Length of Papers can be up to 25 pages and should be formatted
according to the requirements of the journal. Detailed information about
the Journal is available at:
http://www.springer.com/computer/information+systems/journal/11042
Paper Submission All papers must be submitted through the journal’s Editorial Manager
system: http://mtap.edmgr.com
When uploading your paper, please choose article type “DHMS 2009”.
Guest Editor
Dr. Muhammad Khurram Khan
Center of Excellence in Information Assurance (CoEIA), King Saud University,
Kingdom of Saudi Arabia
Email: Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 & Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
IEEE SENSORS 2009 call for papers: 31 March abstracts deadline
ABSTRACT SUBMISSION DEADLINE: 31 March 2009
=======================================
The IEEE SENSORS 2009 conference is scheduled to be held October 25 to October 28, 2009 in Christchurch, New Zealand.
Please submit your abstract at http://www.ieee-sensors2009.org no later than 31 March 2009 (11:59 p.m. Hawaiian time). You will find all the pertinent details pertaining to the conference at this site.
We are excited to announce the following Plenary Speakers:
Recent Advances in Biomagnetics and Bioimaging for Brain Research and Sensing Technologies
Professor Shoogo Ueno (JAPAN)
Department of Applied Quantum Physics, Graduate School of Engineering
Kyushu University
Optical Fiber Sensor Systems
Professor K. T. V. Grattan, (United Kingdom)
Dean, School of Informatics and School of Engineering & Mathematical Science
City University London
Smart Configurable Wireless Sensors and Actuators for Industrial Monitoring and Control
Dr. Asad M. Madni (USA)
Executive Managing Director & CTO of Crocker Capital
Former President & Chief Operating Office of BEI Technologies
Don't miss this wonderful opportunity to visit New Zealand as well as attend the 2009 SENSORS Conference.
If you have a question that is not answered on the conference website, feel free to contact Katharine K. Cline, Conference Manager, at Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 or +1-619-232-9499.
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IEEE SENSORS 2009 is sponsored by the IEEE Sensors Council.
For information, about other Sensors Council activities, especially
the IEEE Sensors Journal, please visit www.ieee.org/sensors
==============================================================
 isic09_callforpapers.pdf | [ ] | 132 Kb |
| isic09_special.pdf | [ ] | 97 Kb |
SCI-EI-indexed CISP’09-BMEI’09: Submission Deadline 20 April
Dear Colleague,
The 2nd International Congress on Image and Signal Processing (CISP 2009) and the 2nd International Conference on BioMedical Engineering and Informatics (BMEI 2009) will be jointly held in Tianjin, China.
Selected best papers will appear in SCI-indexed journal(s). The rest of the accepted papers will be indexed by EI and included in the IEEE Xplore (CISP 2009: IEEE Catalog Number: CFP0994D; ISBN:
978-1-4244-4131-0; Library of Congress: 2009901327. BMEI 2009:
IEEE Catalog Number: CFP0993D; ISBN: 978-1-4244-4134-1; Library of
Congress: 2009901329).
Tianjin is one of the four municipalities in China. It is a financial and commercial center in North China and is known for its numerous travel resources and rich history, such as the Huangyaguan Great Wall, Dule Temple, Panshan Mountain and Food Street. It takes only 30 minutes to travel between Tianjin and Beijing by high-speed train.
The registration fee of US$420 includes lunches, dinners, and banquet.
The previous CISP’09-BMEI’09 attracted over 2600 submissions from more than 30 countries.
CISP’09-BMEI’09 aims to provide a high-level international forum for scientists and researchers to present the state of the art of biomedical engineering, biomedical informatics, multimedia, and signal processing. BMEI’09-CISP’09 is technically co-sponsored by the IEEE Engineering in Medicine and Biology Society.
For more information, visit the conference web page:
http://www.tjut.edu.cn/cisp-bmei2009
If you have any questions after visiting the conference web page, please email the secretariat at Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
Join us at this major event in historic Tianjin !!!
CISP’09-BMEI’09 Organizing Committee
P.S.: Kindly forward to your colleagues or students who may be interested.