台灣電機電子工程學會
Taiwan Institute of Electrical and Electronic Engineering
敬啟者：
2009中華民國系統科學與工程研討會將於98年6月26日於淡江大學工學大樓舉行，論文摘要(extended abstract)截稿日期為98年4月8日，研討會網址：http://www.ee.tku.edu.tw/nssse2009/index.php，歡迎貴學門先進踴躍投稿，共襄盛舉!
中華民國系統學會以提昇國內系統理論、推廣技術與其應用、提供資訊交換與經驗交流為宗旨。秉持這個宗旨，中華民國系統學會今年將於淡江大學舉辦全國性的系統科學與工程會議（National Symposium on System Science and Engineering，NSSSE），期望集合全國在系統科學與工程領域的精英，進行論文與學術研討，以達到資訊交換與經驗交流之目的。使系統科學與工程的進步帶動台灣產業競爭力之提昇、與產品之昇級。本次會議將匯集優秀之研討會論文，推薦並發表於International Journal of Fuzzy Systems 期刊，充分提昇國內系統理論並推廣其技術與應用。
【主辦單位】中華民國系統學會
【協辦單位】國際系統工程學會台灣分會、IEEE SMC Taipei Chapter、淡江大學、IEEE RAS TaipeiChapter、國科會工程處工程科技推展中心
【承辦單位】淡江大學電機系
 nssse2009.pdf | [ ] | 129 Kb |
Call for Papers
Extended Paper Submission Deadline: April 5, 2009
MWSCAS 2009
The 52nd. IEEE International Midwest Symposium on Circuits and Systems will be held on August 2-5, 2009, in Cancún, México.
Cancun is Mexico´s most important tourist destination and one of the world´s most well-known resorts. Located in the state of Quintana Roo in the Yucatan Peninsula region, it has a subtropical climate, with average temperatures ranging between 27º C (81º F) and 35º C (95º F) and sunny days throughout most of the year. Cancun offers the unparalleled beauty of the Caribbean Sea´s turquoise-blue water and white-sand beaches.
********* CALL FOR PAPERS *****************************
The Sixth International Symposium on Wireless Communication Systems
"Broadband Ubiquity for Society Needs"
ISWCS'09 Siena-Tuscany, University of Siena, Italy, September 7?10, 2009
URL: http://www.iswcs.org/iswcs2009/
For information:
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Published papers will appear on IEEE Xplore
Important Dates:
Submission deadline (extended abstracts of full papers): APRIL 16, 2009 (FINAL SHARP DEADLINE) Notification of acceptance: May 25, 2009 Camera-ready of accepted papers: June 22, 2009
This event is co-located with IWSSC 2009 (for more details see: http://iwssc09.dii.unisi.it/)
***********************************************************************
This event is supported by the Vehicular Technology Society.
Technical Co-Sponsorship by IEEE Communications Society.
The objective of this symposium is to provide a forum for researchers and technologists to present new ideas and contributions in the form of technical papers, panel discussions as well as real-world evaluation of many ideas in wireless communications and networking employed to support the needs of the Information Society. This sixth symposium, intends to bring together various wireless communication systems developers to discuss the current status, technical challenges, standards, fundamental issues, and future services and applications. ISWCS'09 seeks to address and capture highly-innovative and state-of-the-art research from the wireless industry as well as standardization advances. The scope of the conference includes a wide range of technical challenges encompassing wireless communications, quality of service support, wireless networking, cross-layer air interface design for improved performance, wireless broadband access, and cooperative networking.
IMPORTANT: the authors of the best papers of ISWCS 2009 will be asked to submit their journal-versions to the Mobile Networks and Applications
(MONET)
Journal (by Springer,
http://www.springer.com/engineering/signals/journal/11036)
that has devoted to us a special issue!
The topics of interest include but are not limited to the following one:
- Cooperative communication systems
- Cognitive radio networks
- Radio resource management
- Wireless access techniques
- Cross-layer air interface design
- Mobile Internet
- Wireless privacy and security
- Wireless IP
- Wireless network architecture and technologies systems
- Digital signal processing
- Standardization in working groups IEEE 802.11, 802.15, and 802.16
- MANETs
- Vehicular Networks (VANETs)
- End-to-End QoS provision
- Coding modulation and equalization
- DVB and DAB techniques
- Novel wireless routing techniques
- Mobility management
- RFID networking
- MIMO
- Traffic control and engineering
- Wireless Mesh Networking
- Wireless sensor networks
- Innovative services and applications
Paper Submission Guidelines:
Acceptance will be based on an extended abstract or a full paper.
In case of an extended abstract submission, diagrams, results, and bibliography have to be provided to allow the reviewers to assess the contribution of your work. In addition to the paper submission, an abstract (approx. 150 words) shall be submitted. The submission has to be performed electronically by April 16, 2009 via the EDAS system; look at the instruction on the conference web
site: http://www.iswcs.org/ISWCS2009/instructions.html.
For information, please send email to the organization:
Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
.
Tutorials:
Proposals for tutorials should consist of a 1000 word summary plus a 150 word abstract with a cover page listing the details of the author(s); tutorial submissions should be made via email to Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 by April 16, 2009. The social event will be organized in the surroundings (country-side) of Siena so that participants will taste the real Tuscany! For information, please send email to: Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 .
Organizing Committee:
General Chair
Giovanni Giambene, University of Siena, Italy
General co-Chair
Yuming Jiang, Norwegian University of Science and Technology (NTNU), Norway
Finance Chair
Boon Sain Yeo, SensiMesh Pte Ltd, Singapore
Technical Program Chair
Rajeev Shorey, GM Research, Bangalore, India Technical Program co-Chairs Falko Dressler, University of Erlangen, Germany Archan Misra, Telcordia Research, USA
Panel Chair
Maria Luisa Merani
University of Modena and Reggio Emilia, Italy
Tutorial Chair
Andreas Kassler
Karlstad University, Sweden
Publication Chair
Paolo Chini, University of Siena, Italy
Web Chair
Ciro Guariglia, University of Siena, Italy
Steering Committee
Boon Sain Yeo (Chair), SensiMesh Pte Ltd, Singapore
Local Organizing Committee
Giuliano Benelli, Giovanni Giambene, Paolo Chini, Samuele Giannetti, Snezana Hadzic, University of Siena, Italy
Conference Secretariat:
Giuliana Pasquini, University of Siena, Italy,
Tel: +39 0577232136, Email:
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---------------------------------------------------------------------
Dr. Giovanni Giambene
Assistant Professor
Dipartimento di Ingegneria dell'Informazione Universita' degli Studi di Siena Via Roma, 56 53100 Siena, Italy
Phone: +39 0577 234603
Mobile phone: +39 320 43 55 871
Fax: +39 0577 233602
E-mail: giambene at unisi.it
Home page: http://marconi.ltt.dii.unisi.it/~giambene/
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【仿神經系統與神經系統輔具國際研討會】
International Workshop on Neuromorphic Systems and Neural Prostheses
◎舉辦日期：98年5月20、21日
◎舉辦地點：清華大學資電館B01
◎主辦單位：清華大學積體電路設計技術研發中心
◎研討會網址：http://neuron.ee.nthu.edu.tw/
<研討會目的>
台灣的晶片設計技術與人才，近年來已名列世界第二。晶片設計技術除了廣泛應用於電子產品，在生醫檢測與新的醫療儀器研發上，也扮演重要的角色。在生醫晶片的研發過程，仿生的概念不但提供新的思維，更有助於發展較人性化的醫療輔具。仿神經工程 (Neuromorphic engineering) 為仿生晶片的重要一環，其主要藉由瞭解與建立腦與神經系統的模型，進而將模型實現成一晶片系統，使晶片具有與神經系統相仿的運算能力，以達到如影像、聲音等訊號的即時處理及生醫感測訊號的智慧處理等。除了提供新的運算能力，由於生物神經細胞間亦由膜電位變化傳遞訊息，仿神經晶片系統進一步可作為輔助神經系統修復的輔具。本研討會目前廣邀國際與台灣知名研究學者，主要研究領域涵蓋神經系統模型與訊號處理、仿神經晶片系統、仿生感官晶片系統、神經電生理與腦機介面、與智慧型生醫晶片等不同領域，使此研討會成為提供與會者了解跨領域知識整合與應用的一個良好機會。
報名方式：
1. 線上報名：詳細訊息請參閱研討會網站：http://neuron.ee.nthu.edu.tw
2. 報名費：
a. 預先報名: 一般註冊：新台幣2,500，學生註冊：新台幣1,200
b. 現場報名: 一般註冊：新台幣2,700，學生註冊：新台幣1,400
聯絡方式：
研討會網址：http://neuron.ee.nthu.edu.tw
電子信箱
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聯絡人：吳宜倢小姐
電話：03-5742210
| neuron-poster.pdf | [ ] | 1712 Kb |
CALL FOR PAPERS
Fifth IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis
October 11-16, 2009, Grenoble, France
The IEEE/ACM/IFIP International Conference on Hardware-Software Codesign and System Synthesis is one of the premier events in design of embedded systems hardware, software, and tools. The conference proudly continues the tradition of being a high-quality forum for active discussion on current and innovative topics. The program will bring together the latest in academic and industrial research and development. High-quality original papers will be accepted for oral presentation followed by interactive poster sessions. Selected papers from the conference proceedings will be targeted for journal publication.
********************************************************************************************************************
AREAS OF INTEREST
The Conference invites papers on all aspects of the design and architecture of embedded computing systems, from application specific to heterogeneous systems, from custom to FPGA implementations, from handheld to high-performance systems. Topics of interest include, but are not limited to:
1. High-level, architectural and system-level synthesis: Synthesis algorithms and tools, integration and design flow, specification and modeling, design representation, partitioning, estimation.
2. Hardware-software co-design: Co-design methodologies, interaction between architecture and software design, HW/SW partitioning, design space exploration, HW/SW interface.
3. Specification languages and models: System-level models and semantics, requirements engineering, formal properties, heterogeneous systems and components, design flow.
4. Simulation and verification: Hardware-software co-simulation, verification methodology, formal verification, HW acceleration, test methodology, design for testability
5. Power-aware design methodology: Power and performance modeling, analysis and estimation techniques, power management approaches, low-power design methodologies
6. Embedded systems architecture: Architecture optimization, application-specific architectures, memory and communication architecture exploration, architecture optimization
7. Embedded software: Compilers, memory management, virtual machines, scheduling, poweraware OS, real-time support and middleware. multi- and manycore, multiprocessor programming models for SoCs and NoCs, profiling techniques and trace generation
8. Application-specific architectures and algorithms: Application-specific processor architectures and tools, hardware accelerators and/or processors for network, media and security applications, reconfigurable processors.
9. Industrial practices and case studies and emerging: techniques Design experiences of high interest to the community. Applications of new state-of-the-art methodologies and tools to real-life problems in various application areas: e.g. wireless, networking, multimedia, automotive, medical systems and sensor networks. New challenges for next generation embedded computing systems, arising from increased heterogeneity, new technologies or new applications.
10. Multiprocessors and MPSoC: Multi- and many-core systems for embedded and general purpose application, design space exploration, MPSoC.
11. Network-on-chip: On-chip communication architectures and protocols, switching, routers and communications space exploration.
********************************************************************************************************************
PAPER SUBMISSION
Papers should represent original work, not published or submitted for publication in other forums. Formal proceedings will be published on CD-ROM and web page forms (copyright by ACM and IEEE). Papers should be submitted electronically on the web. A blind review process will be enforced, thus AUTHORS SHOULD NOT REVEAL AUTHORSHIP DIRECTLY OR INDIRECTLY THROUGH REFERENCES. Papers must be in PDF format and should not exceed 10 pages in ACM two-column format (9pt on 8.5”x11” letter size paper). For formatting instructions and templates, visit:http://www.acm.org/sigs/pubs/proceed/template.html
Proposals for special sessions and panels are also invited. These should be single page, succinctly outlining the topic, positioning and likely participants.
********************************************************************************************************************
IMPORTANT DATES
Deadlines for submission
· Abstract submission: Friday, May 1, 2009
· Full paper submission: Friday, May 8, 2009
· Notification of acceptance: Monday, July 27, 2009
· Deadline for final version: Sunday, Aug. 09, 2009
********************************************************************************************************************
CHAIRS
Program Co-Chairs for CODES+ISSS 2009:
Wolfgang Rosenstiel, Tübingen University, Germany:
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Kazutoshi Wakabayashi, NEC, Japan:
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********************************************************************************************************************
******************* WoRMES’2009 Call for Papers *******************
The 2009 International Workshop on Reconfigurable and
Multi-core Embedded Systems (WoRMES'2009)
http://embedded.cs.ccu.edu.tw/WoRMES2009 http://embedded.cs.ccu.edu.tw/WoRMES2009" rel="nofollow" style="color: rgb(85, 26, 139);">http://embedded.cs.ccu.edu.tw/WoRMES2009" style="font-family: 'Times New Roman', serif;">http://embedded.cs.ccu.edu.tw/WoRMES2009
to be held conjunction with
The 2009 IEEE/IFIP International Conference on
Embedded and Ubiquitous Computing (EUC'2009)
http://cse.stfx.ca/~euc09/ http://cse.stfx.ca/~euc09/" rel="nofollow" style="color: rgb(85, 26, 139);">http://cse.stfx.ca/~euc09/">http://cse.stfx.ca/~euc09/
August 29-31 2009, Vancouver, Canada
*****************************************************************
INTRODUCTION
=============
With the progress and popularization of embedded systems in the past few years, efficiency, instead of functionalities, has become an important factor in measuring the value of embedded systems. How to efficiently use the limited resources in an embedded system to obtain optimal performance has also become a very important issue. Reconfigurable and multi-core architectures are promising solutions to this issue.
TOPICS
======
The WoRMES’2009 workshop provides a forum for discussing the state-of-the-art in reconfigurable computing technologies and multi-core embedded systems and also encourages researchers to publish their experiences in reconfigurable computing technologies, multi-core embedded systems, and the integration of the two research areas. The researchers can share their research result in a comfortable and relaxed environment, and then get some feedback to improve their research and advance the development of reconfigurable computing technologies and multi-core embedded systems.
Topics include but are not limited to：
* Reconfigurable Hardware Architectures
* Run-time Resource Management of Reconfigurable Hardware
* Operating Systems for Reconfigurable Embedded Systems
* Application Design for Reconfigurable Embedded Systems
* Dynamic Partial Reconfiguration Techniques
* Programming Models for Reconfigurable Systems
* Multi-core Operating Systems and Scheduling
* Hardware Designs for Multi-core Architectures
* Multi-core Application Design
* Programming Models for Embedded Multi-core Architectures
* Reconfigurable Multi-core Architecture Design
* Reconfigurable Multi-core SoC Implementation
IMPORTANT DATES
================
Submission deadline: April 15, 2009
Authors Notification: May 25, 2009
Final Manuscript Due: June 15, 2009
Workshop: August 29-31, 2009
PAPER SUBMISSION and PUBLICATION
================================
Prepare the paper with either MS-Word or LaTeX. The max number of pages is 6, plus 2 extra pages to be purchased if necessary. The paper should be submitted in the PDF format. Full papers should be submitted through the submission system:http://embedded.cs.ccu.edu.tw/WoRMES2009/submission http://embedded.cs.ccu.edu.tw/WoRMES2009/submission" rel="nofollow" style="color: rgb(85, 26, 139);">http://embedded.cs.ccu.edu.tw/WoRMES2009/submission" style="font-family: 'Times New Roman', serif;">http://embedded.cs.ccu.edu.tw/WoRMES2009/submission. The accepted papers will be published by IEEE Computer Society Press as a separate proceeding (indexed by EI). Selected papers, after further revisions, will be invited for inclusion in a special issue of the International Journal of Embedded Systems (IJES), Inderscience Publishers.
NOTIFICATION
============
Submitting a paper to the workshop mean that, if the paper is accepted, at least one author should attend the workshop and present the paper. For no-show authors, their papers will be removed from the digital library after the conference and their affiliations will be notified.
ORGANIZATION
============
Program Chairs:
Pao-Ann Hsiung, National Chung Cheng University, Taiwan
Chun-Hsien Lu, National Chung Cheng University, Taiwan
Program Committee:
See WoRMES’2009 web site: http://embedded.cs.ccu.edu.tw/WoRMES2009
For further information regarding the workshop and paper submission, please contact with
General: Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
Program: Pao-Ann Hsiung ( Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 )
Chun-Hsien Lu ( Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它 )
We thought you may like to know that some of the tracks and special sessions at the IEEE VPPC conference are still open to accept submissions. The abstract/digest submitted before April 1, 2009 will be reviewed. Among many important things we would like to mention:
* Accepted papers will be published in VPPC 2009 proceedings that will be included in IEEExplore and EI.
* Best papers from the conference are eligible to be considered for publication on IEEE Transactions on Vehicular Technology special issue on Vehicle Power and Propulsion
* Keynote address from top experts and executives from automotive OEM, supplier, government, and academia
* A technical forum for people to present their work without the burden of writing a full paper
* A banquet held at the Henry Ford Museum on Thursday Sept 11, 2009.
The 5th IEEE International Vehicle Power and Propulsion Conference, September 7-10, 2009 :: Ritz-Carlton Hotel :: Dearborn, Michigan
48128 USA. Please visit the conference website for updated information.
http://www.ewh.ieee.org/conf/vppc
Thank you and we are looking forward to seeing you in Dearborn!
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